High Performance Embedded Box IPC (MIC-7000)


The compact modular PC support i-module expansion to satisfy diverse application requirements. Modular computer reduces lead time for CTOS due to easy configuration and can be widely deployed for factory and machine automation.

  • MIC-770


    Compact Fanless System with 8th/9th Gen Intel® Core™ i CPU Socket (LGA 1151)


  • MIC-770 V2


    Compact Fanless System with 10th Gen Intel® Xeon®/Core™ i CPU Socket (LGA 1200)


  • MIC-770 V3


    Compact Fanless System with 12th/13th/14th Gen Intel® Core™ i CPU Socket (LGA 1700)


  • MIC-7700


    Intel® 6th/7th Generation Core i Desktop Compact Fanless System


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